[1]
E. Turner and M. Taha, “Wide-Bandgap Power Electronics (SiC/GaN): Packaging, Reliability, and Application Roadmaps”, MESO, vol. 1, pp. 1–11, Jul. 2024, Accessed: Nov. 30, 2025. [Online]. Available: https://jmesopen.com/index.php/jmesopen/article/view/10